| Study on 180o peel test of interface adhesive honeycomb sandwich structure | |
| Kewang Peng; Lei ZK(雷振坤); Bai RX(白瑞祥); Wen Wu; Da Liu | |
| 2018 | |
| 会议名称 | 2018 International Conference on Modeling, Simulation and Optimization (MSO) |
| 页码 | 479-483 |
| 会议录 | 2018 International Conference on Modeling, Simulation and Optimization (MSO)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3276123 |
| 专题 | 大连理工大学 |
| 推荐引用方式 GB/T 7714 | Kewang Peng,Lei ZK,Bai RX,et al. Study on 180o peel test of interface adhesive honeycomb sandwich structure[C]. 见:2018 International Conference on Modeling, Simulation and Optimization (MSO). |
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