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	An empirical analysis of package-modularization metrics: Implications for software fault-proneness
	Zhao, Yangyang; Yang, Yibiao; Lu, Hongmin; Zhou, Yuming; Song, Qinbao; Xu, Baowen
刊名	INFORMATION AND SOFTWARE TECHNOLOGY
	2015
卷号	57期号:[db:dc_citation_issue]页码:186-203
关键词	Modularization Fault-proneness Package Prediction Metrics Object-oriented
ISSN号	0950-5849
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3265072
专题	西安交通大学
推荐引用方式 GB/T 7714	Zhao, Yangyang,Yang, Yibiao,Lu, Hongmin,et al. An empirical analysis of package-modularization metrics: Implications for software fault-proneness[J]. INFORMATION AND SOFTWARE TECHNOLOGY,2015,57([db:dc_citation_issue]):186-203.
APA	Zhao, Yangyang,Yang, Yibiao,Lu, Hongmin,Zhou, Yuming,Song, Qinbao,&Xu, Baowen.(2015).An empirical analysis of package-modularization metrics: Implications for software fault-proneness.INFORMATION AND SOFTWARE TECHNOLOGY,57([db:dc_citation_issue]),186-203.
MLA	Zhao, Yangyang,et al."An empirical analysis of package-modularization metrics: Implications for software fault-proneness".INFORMATION AND SOFTWARE TECHNOLOGY 57.[db:dc_citation_issue](2015):186-203.

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