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	Application of micro/nano technology for thermal management of high power LED packaging - A review
	Hamidnia, M.; Luo, Y.; Wang, X. D.
刊名	APPLIED THERMAL ENGINEERING
	2018
卷号	145页码:637-651
关键词	High power LED (HP-LED) Thermal management LED packaging structure Micro/nano technology Material-based thermal solutions Fabrication-based thermal solutions
ISSN号	1359-4311
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3254295
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Hamidnia, M.,Luo, Y.,Wang, X. D.. Application of micro/nano technology for thermal management of high power LED packaging - A review[J]. APPLIED THERMAL ENGINEERING,2018,145:637-651.
APA	Hamidnia, M.,Luo, Y.,&Wang, X. D..(2018).Application of micro/nano technology for thermal management of high power LED packaging - A review.APPLIED THERMAL ENGINEERING,145,637-651.
MLA	Hamidnia, M.,et al."Application of micro/nano technology for thermal management of high power LED packaging - A review".APPLIED THERMAL ENGINEERING 145(2018):637-651.

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