| Forming and packing process of high density mental micro-channel heat sink | |
| Lv, Hui; Zhao, Wen | |
| 2020 | |
| 会议名称 | 7th Asia International Symposium on Mechatronics, AISM 2019 |
| 会议日期 | 2019-09-19 |
| 会议地点 | Hangzhou, China |
| 页码 | 544-552 |
| 会议录 | 7th Asia International Symposium on Mechatronics, AISM 2019
 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3214873 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Nanjing Research Institute of Electronics Technology, Nanjing, 210039, China 2.Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, Dalian University of Technology, Dalian, 116000, China |
| 推荐引用方式 GB/T 7714 | Lv, Hui,Zhao, Wen. Forming and packing process of high density mental micro-channel heat sink[C]. 见:7th Asia International Symposium on Mechatronics, AISM 2019. Hangzhou, China. 2019-09-19. |
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