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	Engineering two-dimensional electronics by semiconductor defects
	Wang, Dan[1]; Li, Xian-Bin[1]; Han, Dong[2]; Tian, Wei Quan[3]; Sun, Hong-Bo[1]
	2017
卷号	16页码:30-45
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3181846
专题	重庆大学
推荐引用方式 GB/T 7714	Wang, Dan[1],Li, Xian-Bin[1],Han, Dong[2],et al. Engineering two-dimensional electronics by semiconductor defects[J],2017,16:30-45.
APA	Wang, Dan[1],Li, Xian-Bin[1],Han, Dong[2],Tian, Wei Quan[3],&Sun, Hong-Bo[1].(2017).Engineering two-dimensional electronics by semiconductor defects.,16,30-45.
MLA	Wang, Dan[1],et al."Engineering two-dimensional electronics by semiconductor defects".16(2017):30-45.

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