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	Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device
	Hu, Borong[1]; Gonzalez, Jose Ortiz[2]; Ran, Li[1,2]; Ren, Hai[1]; Zeng, Zheng[1]; Lai, Wei[1]; Gao, Bing[1]; Alatise, Olayiwola[2]; Lu, Hua[3]; Bailey, Christopher[3]
	2017
卷号	17页码:727-737
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2978251
专题	重庆大学
推荐引用方式 GB/T 7714	Hu, Borong[1],Gonzalez, Jose Ortiz[2],Ran, Li[1,2],et al. Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device[J],2017,17:727-737.
APA	Hu, Borong[1].,Gonzalez, Jose Ortiz[2].,Ran, Li[1,2].,Ren, Hai[1].,Zeng, Zheng[1].,...&Mawby, Phil[2].(2017).Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device.,17,727-737.
MLA	Hu, Borong[1],et al."Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device".17(2017):727-737.

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