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	Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder
	Shen, Jun[1]; Liu, Yongchang[2]; Han, Yajing[2]; Gao, Houxiu[2]
	2006
卷号	25页码:365-370
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2965939
专题	重庆大学
推荐引用方式 GB/T 7714	Shen, Jun[1],Liu, Yongchang[2],Han, Yajing[2],et al. Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder[J],2006,25:365-370.
APA	Shen, Jun[1],Liu, Yongchang[2],Han, Yajing[2],&Gao, Houxiu[2].(2006).Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder.,25,365-370.
MLA	Shen, Jun[1],et al."Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder".25(2006):365-370.

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