| Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds | |
| Qian, Jin; Lin, Ji; Xu, Guang-Kui; Lin, Yuan; Gao, Huajian | |
| 刊名 | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
 |
| 2017 | |
| 卷号 | 101页码:197-208 |
| 关键词 | Thermal fluctuation Molecular bond Peeling Cohesive law Rate dependence Energy dissipation |
| ISSN号 | 0022-5096 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2947474 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Qian, Jin,Lin, Ji,Xu, Guang-Kui,et al. Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2017,101:197-208. |
| APA | Qian, Jin,Lin, Ji,Xu, Guang-Kui,Lin, Yuan,&Gao, Huajian.(2017).Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,101,197-208. |
| MLA | Qian, Jin,et al."Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 101(2017):197-208. |
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