Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites | |
Tian, Bian; Zhang, Zhongkai; Shi, Peng; Zheng, Chen; Yu, Qiuyue; Jing, Weixuan; Jiang, Zhuangde | |
刊名 | REVIEW OF SCIENTIFIC INSTRUMENTS |
2017 | |
卷号 | 88 |
ISSN号 | 0034-6748 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2947383 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Tian, Bian,Zhang, Zhongkai,Shi, Peng,et al. Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2017,88. |
APA | Tian, Bian.,Zhang, Zhongkai.,Shi, Peng.,Zheng, Chen.,Yu, Qiuyue.,...&Jiang, Zhuangde.(2017).Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites.REVIEW OF SCIENTIFIC INSTRUMENTS,88. |
MLA | Tian, Bian,et al."Tungsten-rhenium thin film thermocouples for SiC-based ceramic matrix composites".REVIEW OF SCIENTIFIC INSTRUMENTS 88(2017). |
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