| Measurement Study of Residual Stress on Tungsten-Rhenium Thin Film Thermocouples by Nanoindentation Technology | |
| Tian, Bian; Yu, Qiuyue; Zhang, Zhongkai; Lin, Qijing; Zhao, Na; Jing, Weixuan; Jiang, Zhuangde | |
| 2017 | |
| 关键词 | Residual stress TFTCs Temperature sensor |
| 页码 | 800-803 |
| 会议录 | 2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS)
 |
| URL标识 | 查看原文 |
| ISSN号 | 9781509030590 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2944808 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Tian, Bian,Yu, Qiuyue,Zhang, Zhongkai,et al. Measurement Study of Residual Stress on Tungsten-Rhenium Thin Film Thermocouples by Nanoindentation Technology[C]. 见:. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论