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	Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing
	Ao, S.a; Li, C.a; Zhang, W.a; Wu, M.a; Dai, Y.b; Chen, Y.a; Luo, Z.a
刊名	JOURNAL OF MANUFACTURING PROCESSES
	2019
卷号	Vol.41页码:307-314
关键词	Ultrasonic spot welding Thermal processing Aluminum-copper dissimilar joints Tensile properties Microstructure evolution
ISSN号	1526-6125
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2900122
专题	天津大学
作者单位	1.aSchool of Materials Science and Engineering, Tianjin University, Tianjin, 300350, China 2.bSchool of Education, Tianjin University, Tianjin, 300350, China
推荐引用方式 GB/T 7714	Ao, S.a,Li, C.a,Zhang, W.a,et al. Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing[J]. JOURNAL OF MANUFACTURING PROCESSES,2019,Vol.41:307-314.
APA	Ao, S.a.,Li, C.a.,Zhang, W.a.,Wu, M.a.,Dai, Y.b.,...&Luo, Z.a.(2019).Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing.JOURNAL OF MANUFACTURING PROCESSES,Vol.41,307-314.
MLA	Ao, S.a,et al."Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing".JOURNAL OF MANUFACTURING PROCESSES Vol.41(2019):307-314.

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