| Study on microstructure and properties of Zn-20Sn-0.2Ni-xRE solders | |
| Tian, Jun; Hong, ChunFu; Yan, XiaoHui; Hong, LiHua; Dai, PinQiang | |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 2019 | |
| 卷号 | 30页码:824-831 |
| ISSN号 | 0957-4522 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2887331 |
| 专题 | 福州大学 |
| 推荐引用方式 GB/T 7714 | Tian, Jun,Hong, ChunFu,Yan, XiaoHui,et al. Study on microstructure and properties of Zn-20Sn-0.2Ni-xRE solders[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30:824-831. |
| APA | Tian, Jun,Hong, ChunFu,Yan, XiaoHui,Hong, LiHua,&Dai, PinQiang.(2019).Study on microstructure and properties of Zn-20Sn-0.2Ni-xRE solders.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30,824-831. |
| MLA | Tian, Jun,et al."Study on microstructure and properties of Zn-20Sn-0.2Ni-xRE solders".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30(2019):824-831. |
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