| Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatment | |
| Dai FW(戴风伟); Cao LQ(曹立强) | |
| 刊名 | Electronic Packaging Technology (ICEPT), 2017 18th International Conference
 |
| 2017-09-21 | |
| 文献子类 | 期刊论文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17980]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Dai FW,Cao LQ. Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatment[J]. Electronic Packaging Technology (ICEPT), 2017 18th International Conference,2017. |
| APA | 戴风伟,&曹立强.(2017).Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatment.Electronic Packaging Technology (ICEPT), 2017 18th International Conference. |
| MLA | 戴风伟,et al."Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatment".Electronic Packaging Technology (ICEPT), 2017 18th International Conference (2017). |
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