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	Wetting and interfacial behavior of molten Al-Si alloys on SiC monocrystal substrates: effects of Cu or Zn addition and Pd ion implantation
	Huang, Zhikun; Xu, Wenlong; Liu, Guiwu; Wang, Tingting; Zhang, Xiangzhao; Qiao, Guanjun
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2018
卷号	29页码:17416-17424
ISSN号	0957-4522
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2830170
专题	西安交通大学
推荐引用方式 GB/T 7714	Huang, Zhikun,Xu, Wenlong,Liu, Guiwu,et al. Wetting and interfacial behavior of molten Al-Si alloys on SiC monocrystal substrates: effects of Cu or Zn addition and Pd ion implantation[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29:17416-17424.
APA	Huang, Zhikun,Xu, Wenlong,Liu, Guiwu,Wang, Tingting,Zhang, Xiangzhao,&Qiao, Guanjun.(2018).Wetting and interfacial behavior of molten Al-Si alloys on SiC monocrystal substrates: effects of Cu or Zn addition and Pd ion implantation.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29,17416-17424.
MLA	Huang, Zhikun,et al."Wetting and interfacial behavior of molten Al-Si alloys on SiC monocrystal substrates: effects of Cu or Zn addition and Pd ion implantation".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29(2018):17416-17424.

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