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	A generalized thermal conductivity model for nanoparticle packed bed considering particle deformation
	Zizhen, Lin; Congliang, Huang; Yinshi, Li
刊名	International Journal of Heat and Mass Transfer
	2019
卷号	129页码:28-36
关键词	Ballistic scattering Diffusive scattering Generalized models High performance thermal insulation Particle deformation Thermal conductivity model Thermal contact resistance Thermal insulation materials
ISSN号	0017-9310
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2829184
专题	西安交通大学
推荐引用方式 GB/T 7714	Zizhen, Lin,Congliang, Huang,Yinshi, Li. A generalized thermal conductivity model for nanoparticle packed bed considering particle deformation[J]. International Journal of Heat and Mass Transfer,2019,129:28-36.
APA	Zizhen, Lin,Congliang, Huang,&Yinshi, Li.(2019).A generalized thermal conductivity model for nanoparticle packed bed considering particle deformation.International Journal of Heat and Mass Transfer,129,28-36.
MLA	Zizhen, Lin,et al."A generalized thermal conductivity model for nanoparticle packed bed considering particle deformation".International Journal of Heat and Mass Transfer 129(2019):28-36.

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