Splashing Characteristics of Microparticles From Electrode Erosion for Copper, Molybdenum, and Tungsten-Copper | |
Zhong, Wei; Li, Xingwen; Yang, Lin; Xu, Ao; Jin, Dazhi | |
刊名 | IEEE TRANSACTIONS ON PLASMA SCIENCE |
2019 | |
卷号 | 47页码:1387-1393 |
关键词 | high-speed camera electrode erosion Arc column insulation performance microparticles |
ISSN号 | 0093-3813 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2826718 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Zhong, Wei,Li, Xingwen,Yang, Lin,et al. Splashing Characteristics of Microparticles From Electrode Erosion for Copper, Molybdenum, and Tungsten-Copper[J]. IEEE TRANSACTIONS ON PLASMA SCIENCE,2019,47:1387-1393. |
APA | Zhong, Wei,Li, Xingwen,Yang, Lin,Xu, Ao,&Jin, Dazhi.(2019).Splashing Characteristics of Microparticles From Electrode Erosion for Copper, Molybdenum, and Tungsten-Copper.IEEE TRANSACTIONS ON PLASMA SCIENCE,47,1387-1393. |
MLA | Zhong, Wei,et al."Splashing Characteristics of Microparticles From Electrode Erosion for Copper, Molybdenum, and Tungsten-Copper".IEEE TRANSACTIONS ON PLASMA SCIENCE 47(2019):1387-1393. |
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