Bubble formation on superhydrophobic-micropatterned copper surfaces

doi:10.1016/j.applthermaleng.2011.10.012

CORC > 北京大学 > 工学院

	Bubble formation on superhydrophobic-micropatterned copper surfaces
	Wang, Xinwei ; Zhao, Siwei ; Wang, Hao ; Pan, Tingrui
刊名	applied thermal engineering
	2012
关键词	Micropatterning Superhydrophobicity Boiling heat transfer Bubble formation Nucleation NUCLEATION WATER CHAOS
DOI	10.1016/j.applthermaleng.2011.10.012
英文摘要	Surface physicochemical properties, including wettability and micro-nanoscopic roughness, play an important role in boiling heat transfer and interfacial phenomena. In the paper, we report investigation on bubble formation over superhydrophobic-micropatterned copper surfaces. The distinctive non-wetting micropatterns (of 180 x 180 mu m(2) squares) were fabricated by our recently reported stereomask lithography process, using a novel superhydrophobic nanocomposite formulation. The superhydrophobic nanocomposite, comprised of polytetrafluoroethylene (PTFE) nanoparticles (of 250 nm in diameter) in a polymeric matrix, presented high degree of hydrophobicity (with water contact angle > 150 degrees). Standard boiling processes were studied with or without a prior-degassing procedure, experimentally. In addition, experiments on uniform superhydrophobic coating as well as bare copper surfaces were conducted as control. The experimental investigations revealed that the micropattern-coated copper surfaces had low bubble formation temperatures, similar to the uniformly coated superhydrophobic surfaces; and those emerging bubbles were more spherical and less likely to merge into a vapor layer. (C) 2011 Elsevier Ltd. All rights reserved.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000298519400011&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Thermodynamics; Energy & Fuels; Engineering, Mechanical; Mechanics; SCI(E); EI; 20; ARTICLE; 1; 112-119; 35
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/154643]
专题	工学院
推荐引用方式 GB/T 7714	Wang, Xinwei,Zhao, Siwei,Wang, Hao,et al. Bubble formation on superhydrophobic-micropatterned copper surfaces[J]. applied thermal engineering,2012.
APA	Wang, Xinwei,Zhao, Siwei,Wang, Hao,&Pan, Tingrui.(2012).Bubble formation on superhydrophobic-micropatterned copper surfaces.applied thermal engineering.
MLA	Wang, Xinwei,et al."Bubble formation on superhydrophobic-micropatterned copper surfaces".applied thermal engineering (2012).