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	Microfluidic cooling for distributed hot-spots
	Pi, Yudan ; Wang, Wei ; Chen, Jing ; Jin, Yufeng
	2016
关键词	microfluidic distributed hot-spot thermal spreading THERMAL SPREADING RESISTANCE HEAT SINKS MANAGEMENT
英文摘要	2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads to a serious heat dissipation challenge. Micro-channels based microfluidic cooling, embedded in the interposer or different layers of 3D IC, targeting at inserting heat sink into each layer, can considerably shorten the heat transfer path and thereby enhance the heat dissipation. It is worth noting that because of the spreading resistance, even with the same micro-channel structure, the effective thermal dissipation capability shows different on varies hot-spot size. In this paper, a micro-fluidic cooling chip with different-sized hot-spots was fabricated to investigate the influence of hot-spot characteristics on the cooling ability of the embedded micro-channel. Relationship between temperature and flow rate was experimentally measured as engineering guide in the thermal design of IC with embedded microfluidic cooling.; EI; CPCI-S(ISTP); w.wang@pku.edu.cn; 903-908; 2016-August
语种	英语
出处	66th IEEE Electronic Components and Technology Conference (ECTC)
DOI标识	10.1109/ECTC.2016.161
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/449375]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Pi, Yudan,Wang, Wei,Chen, Jing,et al. Microfluidic cooling for distributed hot-spots. 2016-01-01.

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