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WAFER-LEVEL FABRICATION OF A TRIBOELECTRIC ENERGY HARVESTER
Han, Mengdi ; Yu, Bocheng ; Su, Zongming ; Meng, Bo ; Cheng, Xiaoliang ; Zhang, Xiao-Sheng ; Zhang, Haixia
2015
英文摘要We present a wafer-level fabrication method for triboelectric energy harvester (TEH), which fabricates the TEH completely in batch fabrication process, without any manually assembly step. Finite element method (FEM) simulation was conducted to investigate the open-circuit potential distribution and short-circuit charge distribution. Experimental measurements show that this device can produce 235 mV peak voltage at the frequency of 30 Hz, under the 100 M Omega external resistance. Compared with previous TEHs, the proposed device can be batch fabricated in CMOS-compatible process and the reduced size allows it to be easily integrated with other electronic devices (e.g., keyboards).; EI; CPCI-S(ISTP); zhang-alice@pku.edu.cn; February; 1078-1081; 2015-February
语种英语
出处2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015)
DOI标识10.1109/MEMSYS.2015.7051150
内容类型其他
源URL[http://ir.pku.edu.cn/handle/20.500.11897/423653]  
专题信息科学技术学院
推荐引用方式
GB/T 7714
Han, Mengdi,Yu, Bocheng,Su, Zongming,et al. WAFER-LEVEL FABRICATION OF A TRIBOELECTRIC ENERGY HARVESTER. 2015-01-01.
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