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	A new RF Capacitive Accelerometer Embedded in LTCC Packaging Substrate
	Rui, Cao ; Zhe, Wang ; Hua, Gan ; Jia Songtao ; Miao, Min ; Jin, Yufeng
	2011
关键词	FABRICATION
英文摘要	Based on the former works, this paper demonstrates a new way in making RF capacitor accelerometer based on LTCC substrates, which resist high temperature to a great extent. Moreover, as many parts in an automobiles and aeroplane, such as engine, bearing and gear would dissipate much heat, thus we decided to use LTCC to encapsulate the sensor. We utilized Anslys to run the simulation work, so as to validate the effective of he structure in practical use. In the mean time, we analysis its accuracy, as well as processing the theoretical derivation to consummate our design. The results tum out that the performance of the structure packaged by LTCC overweigh the material of silicon, and its detailed mechanical properties will be illustrated.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000309781000142&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ICEPT.2011.6066917
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/406081]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Rui, Cao,Zhe, Wang,Hua, Gan,et al. A new RF Capacitive Accelerometer Embedded in LTCC Packaging Substrate. 2011-01-01.

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