Fabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch | |
Zhang, Hongze ; Wang, Wei ; Li, Zhihong | |
刊名 | micro nano letters |
2013 | |
DOI | 10.1049/mnl.2013.0300 |
英文摘要 | Reported are the fabrication and thermal stability of an Ru electrode, which is used for a high power Ru-Au contact radio frequency microelectromechanical system switch with a microspring contact design. In this reported work, a new process with bilayer lift-off and a strain release layer is developed, thereby acquiring the 3000 angstrom Ti/Au/Ru electrode with excellent smooth edges for high-power handling capacity and low loss. Furthermore, thermal tests under 400, 500 and 600 degrees C for over 1 h have been performed. Investigation of the surface with scanning electron microscopy and energy dispersive X-ray spectroscopy shows that the electrode has a good thermal stability at 400 degrees C, which is proper for high-power handling. The cold switch DC current handling capacity is advanced from <90 mA per point (failed) to 100 mA per point (still working).; Nanoscience & Nanotechnology; Materials Science, Multidisciplinary; SCI(E); EI; 0; ARTICLE; 10; 587-590; 8 |
语种 | 英语 |
内容类型 | 期刊论文 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/390914] |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Zhang, Hongze,Wang, Wei,Li, Zhihong. Fabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch[J]. micro nano letters,2013. |
APA | Zhang, Hongze,Wang, Wei,&Li, Zhihong.(2013).Fabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch.micro nano letters. |
MLA | Zhang, Hongze,et al."Fabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch".micro nano letters (2013). |
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