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	The investigation of 3D embedded microchannel networks for 3D IC cooling, vacuum packaging and thz passive device applications
	Miao, Min ; Zhang, Jing ; Zhang, Yang ; Han, Bo ; Jin, Yufeng
	2010
英文摘要	This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D IC stackup cooling, vacuum building and even THz passive device applications. Recently, the prominent advantages of 3D IC integration, including reduction in system size, interconnect delay, power dissipation and enabling hyper-integration of chips from disparate process technologies, have drive the relentless research effort worldwide. Although various low-power methodologies are exploited, rapid increasing in device packing density in 3D stacking of chips have demanded revolutionary heat removal technologies, as high performance chips projected to dissipate more than 100W/cm2 and require more than 100A of supply current are frequently integrated. Besides, high data rate and bandwidth interconnects are urgently needed as an efficient data transfer backbone between the chips comprising 3D ICs. To address these limits, the authors investigated 3D microchannel networks with various layouts such as fractal tree, which is embedded into stackup structures for highly efficient cooling, and as THz (terahertz ) range waveguides. The 3D microchannel networks, with water as working medium are designed and simulated with computational fluidic dynamic methodology, which reveals both the flow and temperature fields and verifies their effectiveness in 3D stackup structure cooling. The 3D microchannels are further experimentally validated on a fast microsystem prototyping. ? 2010 by ASME.; EI; 0
语种	英语
DOI标识	10.1115/IMECE2010-39950
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/329561]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Miao, Min,Zhang, Jing,Zhang, Yang,et al. The investigation of 3D embedded microchannel networks for 3D IC cooling, vacuum packaging and thz passive device applications. 2010-01-01.

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