Technology of double side exposure and bonding for fabrication of accelerometer | |
Zhang, TP ; Li, T ; Deng, K | |
1998 | |
英文摘要 | Accuracy of MEMS need to be very high. Accelerometer and gyroscope have been partly fabricated with 1 mu m(double side) processing using Suss Ma6/Ba6. Bonding with 2.5 mu m is difficult, but we realized it. Accelerometer has some good characteristics, such as linear and signal enough strong.; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Materials Science, Characterization & Testing; Materials Science, Coatings & Films; Optics; CPCI-S(ISTP); 0 |
语种 | 英语 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/294016] ![]() |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Zhang, TP,Li, T,Deng, K. Technology of double side exposure and bonding for fabrication of accelerometer. 1998-01-01. |
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