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	Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA
	Li, Shuyu ; Zhou, Xiaoxiong ; Yu, Xiaomei
	2013
关键词	FPA wafer-level vacuum packaging solder bonding bi-material cantilever MICROCANTILEVER DETECTORS
英文摘要	In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3x10(-9) atm.cc/s.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000333192100011&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Optics; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1117/12.2038077
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/292531]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Li, Shuyu,Zhou, Xiaoxiong,Yu, Xiaomei. Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA. 2013-01-01.

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