A bulk micromachined Si-on-glass Tunneling accelerometer with out-of-plane sensing capability | |
Miao, Min ; Hu, Qifang ; Hao, Yilong ; Dong, Haifeng ; Wang, Ling ; Shi, Yunbo ; Shen, Sanmin | |
2007 | |
关键词 | tunneling accelerometer bulk micromachining microelectromechanical system (MEMS) nanoelectromechanical system (NEMS) inertial technology high resolution inductively coupled plasma PRECISION |
英文摘要 | A bulk micromachined tunneling accelerometer on Pyrex 7740 glass substrate is reported in this paper, which is capable of out-of-plane sensing and intended for highly sensitive inertial measurements. Low stress in single crystal Si (SCS) proof mass-suspension structure and low thermal incompatibility between SCS structural layer and substrate can minimize low frequency noise of the device. Double-face ICP etchings are utilized to define the movable proof mass and suspension: one made on the face with the tip to partially defines the movable structure before anodic bonding, and another made to releases the movable structure after the bonding. The process can avoid severe blades, as found on beams of samples fabricated with previous process. A 3-order closed loop control circuit is used to keep the tip staying close to the optimal operation position and to ensure favorable linearity over the measuring range. Theoretical analysis and design of the control electronics are presented. The device is tested in low noise environment and the result shows an excellent low frequency resolution of 0.015mg/rtHz (@1 similar to 100Hz), and nonlinearity < 2% over +/-10g input (<1% over +/-1g).; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 0 |
语种 | 英语 |
DOI标识 | 10.1109/NEMS.2007.352270 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/153354] |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Miao, Min,Hu, Qifang,Hao, Yilong,et al. A bulk micromachined Si-on-glass Tunneling accelerometer with out-of-plane sensing capability. 2007-01-01. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论