Packaging of high power semiconductor laser arrays using a novel macro-channel cooler

	Packaging of high power semiconductor laser arrays using a novel macro-channel cooler
	Wang Jingwei ; Yuan Zhenbang ; Guo Lu ; Xiong Lingling ; Zhang Yanxin ; Peng Chenhui ; Li Xiaoning ; Liu Xingsheng(刘兴胜)
	2010
会议名称	2010 11th international conference on electronic packaging technology and high density packaging, icept-hdp 2010
会议日期	2010-08-16
会议地点	xi'an, china
页码	92-97
收录类别	EI
会议主办者	electron. manuf. packag. technol. soc. chin. inst. electron.; ieee compon., packag., manuf. technol. soc. (ieee-cpmt); xidian university
会议录	proceedings - 2010 11th international conference on electronic packaging technology and high density packaging, icept-hdp 2010
会议录出版者	association for computing machinery
会议录出版地	1515 broadway, 17th floor, new york, ny 10036-5701, united states
学科主题	物理科学和化学
语种	英语
ISSN号	18777058
ISBN号	9781424481422
内容类型	会议论文
源URL	[http://ir.opt.ac.cn/handle/181661/11820]
专题	西安光学精密机械研究所_瞬态光学技术国家重点实验室
推荐引用方式 GB/T 7714	Wang Jingwei,Yuan Zhenbang,Guo Lu,et al. Packaging of high power semiconductor laser arrays using a novel macro-channel cooler[C]. 见:2010 11th international conference on electronic packaging technology and high density packaging, icept-hdp 2010. xi'an, china. 2010-08-16.