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	Feature-Scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics
	Wang, Dong ; Shao, Sihong ; Yan, Changhao ; Cai, Wei ; Zeng, Xuan
	2014
关键词	Chemical mechanical polishing smoothed particle hydrodynamics particulate flow rough pad wafer defects abrasive concentration MATERIAL REMOVAL RATE NUMERICAL-SIMULATION CONTACT-MECHANICS MOLECULAR SCALE FLUID PRESSURE SPH CMP PLANARIZATION MODEL SIZE
英文摘要	In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes are investigated in detail by the smoothed particle hydrodynamics (SPH) method. The feature-scale behaviours of slurry flow, rough pad, wafer defects, moving solid boundaries, slurry-abrasive interactions, and abrasive collisions are modelled and simulated. Compared with previous work on CMP simulations, our simulations incorporate more realistic physical aspects of the CMP process, especially the effect of abrasive concentration in the slurry flows. The preliminary results on slurry flow in CMP provide microscopic insights on the experimental data of the relation between the removal rate and abrasive concentration and demonstrate that SPH is a suitable method for the research of CMP processes.; Physics, Mathematical; SCI(E); 0; ARTICLE; sihong@math.pku.edu.cn; xzeng@fudan.edu.cn; 5; 1389-1418; 16
语种	英语
出处	SCI
出版者	communications in computational physics
内容类型	其他
源URL	[http://hdl.handle.net/20.500.11897/388433]
专题	数学科学学院
推荐引用方式 GB/T 7714	Wang, Dong,Shao, Sihong,Yan, Changhao,et al. Feature-Scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics. 2014-01-01.

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