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	Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step
	Ji, Zhuoyu1,2; Li, Hongxiang1; Liu, Yaling1,2; Hu, Wenping1
刊名	Applied physics a-materials science & processing
	2008-05-01
卷号	91期号:2页码:301-303
ISSN号	0947-8396
DOI	10.1007/s00339-008-4399-0
通讯作者	Hu, wenping(huwp@iccas.ac.cn)
英文摘要	In this paper we propose a method for the integration of the synthesis of silver-tetracyanoquinodimethane (agtcnq) and the fabrication of its devices within one step. the method was performed by electroplating ag between gold coplanar micro-gap electrodes in tetracyanoquinodimethane (tcnq) solution. as soon as silver was electrochemically dissolved in the tcnq solution, it immediately reacted with tcnq to form agtcnq and then deposited between au gap electrodes. with the continuing of the reaction, the au micro-gap electrodes were connected by agtcnq to form au/agtcnq/au coplanar gap devices. with this electroplating technique, series gap devices of agtcnq were fabricated, and the devices exhibited switching phenomena with good reproducibility. this method integrated the synthesis of agtcnq and the fabrication of its devices within a single step, and should be also inspirable for other charge transfer complexes.
WOS关键词	THIN-FILMS ; NANOWIRES ; SALTS
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Physics, Applied
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000254086700017
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2392719
专题	中国科学院大学
通讯作者	Hu, Wenping
作者单位	1.Chinese Acad Sci, Inst Chem, Beijing Normal Lab Mol Sci, Key Lab Organ Solids, Beijing 100080, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
推荐引用方式 GB/T 7714	Ji, Zhuoyu,Li, Hongxiang,Liu, Yaling,et al. Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step[J]. Applied physics a-materials science & processing,2008,91(2):301-303.
APA	Ji, Zhuoyu,Li, Hongxiang,Liu, Yaling,&Hu, Wenping.(2008).Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step.Applied physics a-materials science & processing,91(2),301-303.
MLA	Ji, Zhuoyu,et al."Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step".Applied physics a-materials science & processing 91.2(2008):301-303.

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