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	An bidirectional IP wrapper design for SoC DFT
	Ren, Xiaojun[1]; Zhang, Jinyi[2]; Cao, Xing[3]; Li, Jiao[4]
	2006
会议名称	2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
会议日期	2005-06-27
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2391314
专题	上海大学
作者单位	[1]MicroElectronics R and D Center, Shanghai University, 149 Yanchang Road, Shanghai, 200072, China [2]School of Communication and Information Engineering, Shanghai University, 149 Yanchang Road, Shanghai, 200072, China [3]MicroElectronics R and D Center, Shanghai University, 149 Yanchang Road, Shanghai, 200072, China [4]College of Sciences, Shanghai University, 149 Yanchang Road, Shanghai, 200072, China
推荐引用方式 GB/T 7714	Ren, Xiaojun[1],Zhang, Jinyi[2],Cao, Xing[3],et al. An bidirectional IP wrapper design for SoC DFT[C]. 见:2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05. 2005-06-27.

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