The study of improved RWPA for the multiple-core chip | |
Cao, Xing[1]; Zhang, Jinyi[2]; Ren, Xiaojun[3] | |
2006 | |
会议名称 | 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 |
会议日期 | 2005-06-27 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2391310 |
专题 | 上海大学 |
作者单位 | [1]Micro-Electronics Research and Design Center, Shanghai University, Zhabei, Shanghai, 200072, China[2]Micro-Electronics Research and Design Center, Shanghai University, Zhabei, Shanghai, 200072, China[3]Micro-Electronics Research and Design Center, Shanghai University, Zhabei, Shanghai, 200072, China |
推荐引用方式 GB/T 7714 | Cao, Xing[1],Zhang, Jinyi[2],Ren, Xiaojun[3]. The study of improved RWPA for the multiple-core chip[C]. 见:2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05. 2005-06-27. |
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