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	Effect of pulse magnetic field on solidification structure and properties of pure copper
	Liao Xi-liang[1]; Gong Yong-yong[2]; Li Ren-xing[3]; Chen Wen-jie[4]; Zhai Qi-jie[5]
刊名	CHINA FOUNDRY
	2007
卷号	4页码:116-119
关键词	pure copper pulse magnetic field solidification structure property
ISSN号	1672-6421
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2383939
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China. 2.Shandong Univ, Sch Mech Engn, Jinan 250061, Peoples R China. 3.[2]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China. 4.[3]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China. 5.[4]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China. 6.[5]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Liao Xi-liang[1],Gong Yong-yong[2],Li Ren-xing[3],et al. Effect of pulse magnetic field on solidification structure and properties of pure copper[J]. CHINA FOUNDRY,2007,4:116-119.
APA	Liao Xi-liang[1],Gong Yong-yong[2],Li Ren-xing[3],Chen Wen-jie[4],&Zhai Qi-jie[5].(2007).Effect of pulse magnetic field on solidification structure and properties of pure copper.CHINA FOUNDRY,4,116-119.
MLA	Liao Xi-liang[1],et al."Effect of pulse magnetic field on solidification structure and properties of pure copper".CHINA FOUNDRY 4(2007):116-119.

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