| The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish | |
| Zhang, Lili[1]; Andersson, Cristina[2]; Liu, Johan[3]; Cheng, Zhaonian[4] | |
| 2008 | |
| 会议名称 | ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS |
| 会议日期 | 2008-09-01 |
| 页码 | 1295-1300 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2347029 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Sch Automat & Mech Engn, SMIT Ctr,SHU Intel Joint Packaging Ctr, Key Lab Adv Display & Syst Applicat,Ministry Educ, Shanghai 200072, Peoples R China. 2.Chalmers, Dept Microtechnol & Nanosci, Bionano Syst Lab, SMIT Ctr, SE-41296 Gothenburg, Sweden. |
| 推荐引用方式 GB/T 7714 | Zhang, Lili[1],Andersson, Cristina[2],Liu, Johan[3],et al. The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish[C]. 见:ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS. 2008-09-01. |
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