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	Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate
	Yin, Luqiao[1]; Yang, Weiqiao[2]; Guo, Yansheng[3]; Ma, Kejun[4]; Li, Shuzhi[5]; Chen, Mingfa[6]; Li, Jia[7]; Zhang, Jianhua[8]
	2008
会议名称	58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS
会议日期	2008-05-27
页码	790-794
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2346203
专题	上海大学
作者单位	1.Shanghai Univ, Sch Mech & Automat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Sch Mech & Automat, POB 143,149 Yanchang Rd, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Yin, Luqiao[1],Yang, Weiqiao[2],Guo, Yansheng[3],et al. Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate[C]. 见:58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS. 2008-05-27.

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