| Case Study: Alleviating Hotspots and Improving Chip Reliability via Carbon Nanotube Thermal Interface | |
| Zhang, Wei[1]; Huang, Jiale[2]; Yang, Shengqi[3]; Gupta, Pallav[4] | |
| 2011 | |
| 会议名称 | Design, Automation and Test in Europe Conference (DATE) |
| 会议日期 | 2011-03-14 |
| 页码 | 1071-1076 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2309819 |
| 专题 | 上海大学 |
| 作者单位 | 1.[1]Nanyang Technol Univ, Sch Comp Sci, Singapore 639798, Singapore. 2.[2]Shanghai Univ, Sch Comm & Info Engg, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Sch Comm & Info Engg, Shanghai 200072, Peoples R China. 4.[4]Intel Corp, Core CAD Technol, Folsom, CA 95630 USA. |
| 推荐引用方式 GB/T 7714 | Zhang, Wei[1],Huang, Jiale[2],Yang, Shengqi[3],et al. Case Study: Alleviating Hotspots and Improving Chip Reliability via Carbon Nanotube Thermal Interface[C]. 见:Design, Automation and Test in Europe Conference (DATE). 2011-03-14. |
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