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	Silver Nanowires Stability and Burying into Substrates Under MeV Proton Irradiation
	Shehla, Honey[1]; Ishaq, Ahmad[2]; Awais, Ali[3]; Thema, Force T.[4]; Javed, Iqbal[5]; Wang, Dongyun[6]; Rauf, Khan[7]; Nasir, Khan[8]; Shahzad, Nasreen[9]; Maaza, Malik[10]
刊名	CURRENT NANOSCIENCE
	2016
卷号	12页码:774-780
关键词	Ag nanowires ion-induced viscous flow mass transport proton irradiation radiation stability thermal spike model
ISSN号	1573-4137
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2227482
专题	上海大学
作者单位	1.[1]Natl Ctr Phys, Islamabad 44000, Pakistan. 2.Univ Punjab, Ctr Excellence Solid State Phys, Lahore, Pakistan. 3.Univ South Africa, Coll Grad Studies, UNESCO UNISA Africa Chair Nanosci Nanotechnol, POB 392, Pretoria, South Africa.,iThemba LABS Natl Res Fdn, Nanosci African Network NANOAFNET, 1 OldFaure Rd,POB 722, Somerset West, Western Cape Pr, South Africa. 4.[2]Natl Ctr Phys, Islamabad 44000, Pakistan. 5.[3]Natl Ctr Phys, Islamabad 44000, Pakistan. 6.[4]Univ South Africa, Coll Grad Studies, UNESCO UNISA Africa Chair Nanosci Nanotechnol, POB 392, Pretoria, South Africa.,iThemba LABS Natl Res Fdn, Nanosci African Network NANOAFNET, 1 OldFaure Rd,POB 722, Somerset West, Western Cape Pr, South Africa. 7.[5]Quaid I Azam Univ, Dept Phys, Islamabad, Pakistan. 8.[6]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 9.[7]Univ Azad Jamu & Kashmire, Dept Phys, Muzaffarabad, Pakistan. 10.[8]PINSTECH, Div Phys, PO Nilore, Islamabad 45600, Pakistan.
推荐引用方式 GB/T 7714	Shehla, Honey[1],Ishaq, Ahmad[2],Awais, Ali[3],et al. Silver Nanowires Stability and Burying into Substrates Under MeV Proton Irradiation[J]. CURRENT NANOSCIENCE,2016,12:774-780.
APA	Shehla, Honey[1].,Ishaq, Ahmad[2].,Awais, Ali[3].,Thema, Force T.[4].,Javed, Iqbal[5].,...&Maaza, Malik[10].(2016).Silver Nanowires Stability and Burying into Substrates Under MeV Proton Irradiation.CURRENT NANOSCIENCE,12,774-780.
MLA	Shehla, Honey[1],et al."Silver Nanowires Stability and Burying into Substrates Under MeV Proton Irradiation".CURRENT NANOSCIENCE 12(2016):774-780.

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