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	A high power LED device with chips directly mounted on heat pipes (EI收录)
	Tang, Yong[1]; Ding, Xinrui[1]; Yu, Binhai[1]; Li, Zongtao[1]; Liu, Bin[1]
刊名	Applied Thermal Engineering
	2014
卷号	66页码:632-639
关键词	Copper Heat pipes Heat resistance
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2216606
专题	华南理工大学
作者单位	[1] Key Laboratory of Surface Functional Structure Manufacturing, School of Mechanical and Automotive Engineering, South China University of Technology, Guangdong, China
推荐引用方式 GB/T 7714	Tang, Yong[1],Ding, Xinrui[1],Yu, Binhai[1],等. A high power LED device with chips directly mounted on heat pipes (EI收录)[J]. Applied Thermal Engineering,2014,66:632-639.
APA	Tang, Yong[1],Ding, Xinrui[1],Yu, Binhai[1],Li, Zongtao[1],&Liu, Bin[1].(2014).A high power LED device with chips directly mounted on heat pipes (EI收录).Applied Thermal Engineering,66,632-639.
MLA	Tang, Yong[1],et al."A high power LED device with chips directly mounted on heat pipes (EI收录)".Applied Thermal Engineering 66(2014):632-639.

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