QQ客服 官方微博 反馈留言

	Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging (EI收录SCI收录)
	Chen, Yun[1]; Wang, Fuliang[2]; Li, Han-Xiong[1,3]
刊名	IEEE Transactions on Components, Packaging and Manufacturing Technology
	2015
卷号	5页码:1019-1026
关键词	Analytical models Cameras High speed cameras Silicones
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2212100
专题	华南理工大学
作者单位	1.[1] Key Laboratory of Mechanical Equipment Manufacturing and Control Technology, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 2.510640, China 3.[2] State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 4.410008, China 5.[3] Department of Systems Engineering and Engineering Management, City University of Hong Kong, Hong Kong
推荐引用方式 GB/T 7714	Chen, Yun[1],Wang, Fuliang[2],Li, Han-Xiong[1,3]. Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging (EI收录SCI收录)[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2015,5:1019-1026.
APA	Chen, Yun[1],Wang, Fuliang[2],&Li, Han-Xiong[1,3].(2015).Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging (EI收录SCI收录).IEEE Transactions on Components, Packaging and Manufacturing Technology,5,1019-1026.
MLA	Chen, Yun[1],et al."Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging (EI收录SCI收录)".IEEE Transactions on Components, Packaging and Manufacturing Technology 5(2015):1019-1026.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。