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	Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging (EI收录)
	Chen, Yun[1]; Li, Han-Xiong[2,3]; Shan, Xiuyang[2]; Gao, Jian[1]; Chen, Xin[1]; Wang, Fuliang[2]
刊名	Ultrasonics Sonochemistry
	2016
卷号	28页码:15-20
关键词	Light emitting diodes Microelectronics Ultrasonics
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2196845
专题	华南理工大学
作者单位	1.[1] Key Laboratory of Mechanical Equipment Manufacturing and Control Technology, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China 2.[2] School of Mechanical and Electrical Engineering, Central South University, State Key Laboratory of High Performance Complex Manufacturing, Changsha, China 3.[3] Department of Systems Engineering and Engineering Management, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong, Hong Kong
推荐引用方式 GB/T 7714	Chen, Yun[1],Li, Han-Xiong[2,3],Shan, Xiuyang[2],等. Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging (EI收录)[J]. Ultrasonics Sonochemistry,2016,28:15-20.
APA	Chen, Yun[1],Li, Han-Xiong[2,3],Shan, Xiuyang[2],Gao, Jian[1],Chen, Xin[1],&Wang, Fuliang[2].(2016).Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging (EI收录).Ultrasonics Sonochemistry,28,15-20.
MLA	Chen, Yun[1],et al."Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging (EI收录)".Ultrasonics Sonochemistry 28(2016):15-20.

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