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	Microfabrication of conductive copper patterns by meniscus-confined electrodeposition
	Lei, Yu[1]; Gao, Fangpu[2]; Guo, Jianjun[3]; Xu, Gaojie[4]; Yang, Yitao[5]
刊名	INTEGRATED FERROELECTRICS
	2018
卷号	190页码:164-172
关键词	Microfabrication electrodeposition copper wire meniscus 3D printing
ISSN号	1058-4587
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2171562
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 2.Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Addit Mfg Mat, Ningbo, Zhejiang, Peoples R China. 3.[2]Shandong Energy Zaozhuang Min Grp Xian Coal Ltd, Zaozhuang, Peoples R China. 4.[3]Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Addit Mfg Mat, Ningbo, Zhejiang, Peoples R China. 5.[4]Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Addit Mfg Mat, Ningbo, Zhejiang, Peoples R China. 6.[5]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China.
推荐引用方式 GB/T 7714	Lei, Yu[1],Gao, Fangpu[2],Guo, Jianjun[3],et al. Microfabrication of conductive copper patterns by meniscus-confined electrodeposition[J]. INTEGRATED FERROELECTRICS,2018,190:164-172.
APA	Lei, Yu[1],Gao, Fangpu[2],Guo, Jianjun[3],Xu, Gaojie[4],&Yang, Yitao[5].(2018).Microfabrication of conductive copper patterns by meniscus-confined electrodeposition.INTEGRATED FERROELECTRICS,190,164-172.
MLA	Lei, Yu[1],et al."Microfabrication of conductive copper patterns by meniscus-confined electrodeposition".INTEGRATED FERROELECTRICS 190(2018):164-172.

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