Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology | |
Cao Q | |
刊名 | ieee photonics technology letters |
2011 | |
卷号 | 23期号:13页码:881-883 |
关键词 | Resonant cavity enhanced (RCE) photodetector silicon photonics sol-gel wafer bonding thermal tuning INTERFACIAL ENERGY SILICON-WAFERS HIGH-SPEED TEMPERATURE PHOTODIODES MORPHOLOGY POWER |
ISSN号 | 1041-1135 |
通讯作者 | zhang, lz, chinese acad sci, inst semicond, beijing 100083, peoples r china. zhang.labs@gmail.com ; pobakey@semi.ac.cn ; yhzuo@semi.ac.cn ; clxue@semi.ac.cn ; cbw@semi.ac.cn ; qmwang@semi.ac.cn |
学科主题 | 光电子学 |
收录类别 | SCI |
资助信息 | national basic research program of china [2006cb302802]; national natural science foundation [60676005, 60906035]; chinese academy of sciences [iscas2009t01] |
语种 | 英语 |
公开日期 | 2011-07-05 ; 2011-07-15 |
附注 | we report resonant cavity enhanced (rce) ingaas/si photodetectors fabricated by sol-gel wafer bonding technology. the bonding temperature was 300 degrees c. a 60-mu m-diameter photodetector demonstrated dark current density of 0.59 pa/mu m(2) at 0-v bias and 24.7 pa/mu m(2) at 2-v reverse bias, peak responsivity of 0.7 a/w, and full-width at half-maximum (fwhm) of 6 nm around 1.55 mu m. the 3-db bandwidth of a 20-mu m-diameter photodetector was 17.05 ghz under 1-v reverse bias voltage. red shift of the resonant wavelength caused by thermo-optic effect was observed. the thermal tuning range achieved 15 nm. |
内容类型 | 期刊论文 |
源URL | [http://ir.semi.ac.cn/handle/172111/20945] |
专题 | 半导体研究所_集成光电子学国家重点实验室 |
推荐引用方式 GB/T 7714 | Cao Q. Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology[J]. ieee photonics technology letters,2011,23(13):881-883. |
APA | Cao Q.(2011).Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology.ieee photonics technology letters,23(13),881-883. |
MLA | Cao Q."Wavelength-Tunable Si-Based InGaAs Resonant Cavity Enhanced Photodetectors Using Sol-Gel Wafer Bonding Technology".ieee photonics technology letters 23.13(2011):881-883. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论