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	Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder (EI收录)
	Wei, Guoqiang[1]; Wang, Lei[1]
会议名称	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
会议日期	August 13, 2012 - August 16, 2012
会议地点	Guilin, China
关键词	Cooling Electronics packaging Eutectics Grain refinement Grain size and shape Microhardness Microstructure Silver Soldered joints Soldering alloys
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2054575
专题	华南理工大学
作者单位	[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China
推荐引用方式 GB/T 7714	Wei, Guoqiang[1],Wang, Lei[1]. Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder (EI收录)[C]. 见:ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. Guilin, China. August 13, 2012 - August 16, 2012.

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