| A highly conductive thermoplastic electrically conductive adhesive for flexible and low cost electronics (CPCI-S收录) | |
| Wu, Haoyi[1]; Yang, Cheng[1]; Liu, Jingping[1]; Cui, Xiaoya[1]; Xie, Binghe[1]; Zhang, Zhexu[1] | |
| 会议名称 | 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 关键词 | printed electronics flexible electronics conductive adhesive |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2046437 |
| 专题 | 华南理工大学 |
| 作者单位 | Tsinghua Univ, Grad Sch Shenzhen, Shenzhen 518057, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wu, Haoyi[1],Yang, Cheng[1],Liu, Jingping[1],等. A highly conductive thermoplastic electrically conductive adhesive for flexible and low cost electronics (CPCI-S收录)[C]. 见:2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). |
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