Electroless Ni-plated graphene for tensile strength enhancement of copper

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	Electroless Ni-plated graphene for tensile strength enhancement of copper
	Zhou, Xufeng; Jiang, Rongrong; Liu, Zhaoping
刊名	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
	2017
卷号	679 页码:323-328
ISSN号	0921-5093
英文摘要	Graphene nanosheets have shown a significant strengthening effect for metal matrixes. In this paper, we develop a novel eletroless plating method to prepare Ni decorated graphene as an enhancing component in a copper matrix. A good dispersion of Ni nanoparticles on graphene sheets is achieved, which effectively enhances the interfacial compatibility between graphene and copper. The electroless plated graphene-copper composite bulk has a better performance in the mechanical tensile strength compared to pure copper, and also maintains superior ductility, elongation and electrical conductivity.
公开日期	2017-12-25
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/14046]
专题	2017专题
推荐引用方式 GB/T 7714	Zhou, Xufeng,Jiang, Rongrong,Liu, Zhaoping. Electroless Ni-plated graphene for tensile strength enhancement of copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2017,679:323-328.
APA	Zhou, Xufeng,Jiang, Rongrong,&Liu, Zhaoping.(2017).Electroless Ni-plated graphene for tensile strength enhancement of copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,679,323-328.
MLA	Zhou, Xufeng,et al."Electroless Ni-plated graphene for tensile strength enhancement of copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 679(2017):323-328.