Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2017专题

	Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
	Dong, Chaofang; Yi, Pan; Xiao, Kui; Ding, Kangkang; Li, Xiaogang
刊名	MATERIALS
	2017
卷号	10 期号:2 页码:137
ISSN号	1996-1944
英文摘要	The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.
公开日期	2017-12-25
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/14005]
专题	2017专题
推荐引用方式 GB/T 7714	Dong, Chaofang,Yi, Pan,Xiao, Kui,et al. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers[J]. MATERIALS,2017,10(2):137.
APA	Dong, Chaofang,Yi, Pan,Xiao, Kui,Ding, Kangkang,&Li, Xiaogang.(2017).Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers.MATERIALS,10(2),137.
MLA	Dong, Chaofang,et al."Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers".MATERIALS 10.2(2017):137.