Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors

	Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors
	Dexin Kong; Fengqi Yu
刊名	IEICE Electronics Express
	2017
文献子类	期刊论文
英文摘要	It is widely known that the inaccuracy of BJT-based CMOS temperature sensors is higher at high temperature range, which greatly limits their application. In this calibration is analyzed. Through the experiments, we discover that the cause paper, the characteristic of the error after
URL标识	查看原文
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/12018]
专题	深圳先进技术研究院_医工所
作者单位	IEICE Electronics Express
推荐引用方式 GB/T 7714	Dexin Kong,Fengqi Yu. Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors[J]. IEICE Electronics Express,2017.
APA	Dexin Kong,&Fengqi Yu.(2017).Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors.IEICE Electronics Express.
MLA	Dexin Kong,et al."Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors".IEICE Electronics Express (2017).