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	Thermally Reversible and Crosslinked Polyurethane based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-temperature
	Jinhui Li; Qiang Liu; Guoping Zhang; Bin Zhao; Rong Sun; Ching-Ping Wong
	2017
会议地点	Orlando，the USA
英文摘要	2.5D and 3D integration technology using temporary bonding has become main stream in the semiconductor industry in recent years. However, thermal stability, low damage, and debonding at comparative low temperature are still areas of challenge. In this present study, a novel three-dimensional crosslinked polyurethane (3DPU) based on thermal reversible Diels-Alder chemistry, which can be used as temporary bonding adhesive to support wafer thinning and back side processes and be debonded by typical thermal-sliding method at comparatively low-temperature, has been developed. The crosslinked 3DPU showed high thermal stability and excellent adhesion strength both at room temperature and higher temperature. The adhesion strength of 3DPU decreased when the wafer pair was heat to the de-bonding temperature (150 oC) when the retro-DA reaction happened which guaranteed a lowtemperature de-bonding process
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/11858]
专题	深圳先进技术研究院_集成所
作者单位	2017
推荐引用方式 GB/T 7714	Jinhui Li,Qiang Liu,Guoping Zhang,et al. Thermally Reversible and Crosslinked Polyurethane based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-temperature[C]. 见:. Orlando，the USA.

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