AN APPROXIMATE ALGORITHM TO SOLVE LINEAR SYSTEMS BY MATRIX WITH OFF-DIAGONAL EXPONENTIAL DECAY ENTRIES

	AN APPROXIMATE ALGORITHM TO SOLVE LINEAR SYSTEMS BY MATRIX WITH OFF-DIAGONAL EXPONENTIAL DECAY ENTRIES
	Chang, Qiangshun 1,2; Lin, Yanping 3; Xu, Shuzhan 4
刊名	INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING
	2018
卷号	15 期号:3 页码:340-352
关键词	Linear equation numerical solution sub-linear system decomposition
ISSN号	1705-5105
英文摘要	We present an approximate algorithm to solve only one variable out of a linear system defined by a matrix with off-diagonal exponential decay entries (including the practically most important class of band limited matrices) via a sub linear system. This approach thus enables US to solve any subset of solution variables. Parallel implementation of such approximate schemes for every variable enables us to solve the linear system With computational time independent of the matrix size.
WOS研究方向	Mathematics
语种	英语
出版者	ISCI-INST SCIENTIFIC COMPUTING & INFORMATION
WOS记录号	WOS:000429094100002
内容类型	期刊论文
源URL	[http://ir.amss.ac.cn/handle/2S8OKBNM/30005]
专题	中国科学院数学与系统科学研究院
通讯作者	Chang, Qiangshun
作者单位	1.Jiangsu Normal Univ, Sch Math & Stat, Xuzhou, Peoples R China 2.Chinese Acad Sci, Inst Appl Math, Beijing, Peoples R China 3.Hong Kong Polytech Univ, Dept Appl Math, Kowloon, Hong Kong, Peoples R China 4.Shangrilantis Ltd, Hong Kong, Hong Kong, Peoples R China
推荐引用方式 GB/T 7714	Chang, Qiangshun,Lin, Yanping,Xu, Shuzhan. AN APPROXIMATE ALGORITHM TO SOLVE LINEAR SYSTEMS BY MATRIX WITH OFF-DIAGONAL EXPONENTIAL DECAY ENTRIES[J]. INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING,2018,15(3):340-352.
APA	Chang, Qiangshun,Lin, Yanping,&Xu, Shuzhan.(2018).AN APPROXIMATE ALGORITHM TO SOLVE LINEAR SYSTEMS BY MATRIX WITH OFF-DIAGONAL EXPONENTIAL DECAY ENTRIES.INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING,15(3),340-352.
MLA	Chang, Qiangshun,et al."AN APPROXIMATE ALGORITHM TO SOLVE LINEAR SYSTEMS BY MATRIX WITH OFF-DIAGONAL EXPONENTIAL DECAY ENTRIES".INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING 15.3(2018):340-352.