Flip Chip Technologies and Their Applications in MEMS Packaging

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	Flip Chip Technologies and Their Applications in MEMS Packaging
	Wang HY(汪海英); Bai YL(白以龙)
刊名	International Journal of Nonlinear Sciences and Numerical Simulation
	2002
卷号	3 期号:3-4 页码:433-436
ISSN号	1565-1339
通讯作者	Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
中文摘要	The high cost and undesirable bulky packages have been and continues to be major stumbling blocks in commercializing MEMS products. Flip chip technologies are very promising techniques for MEMS packaging. This paper presents a brief introduction of flip chip technologies as well as examples of successful applications of flip chip technologies in MEMS (e.g. RF and optical MEMS, micro sensors) packaging. The result shows that, although MEMS packaging is much more complicated than that for microelectronics, flip chip technologies can be applicable means of integrating MEMS devices. It is also shown that to meet different packaging requirements of various MEMS devices, bumping materials, bumping process and joining methods must be chosen carefully. Issues, such as package deformation, temperature distributions, heat sink placement, are all very crucial for the performance of MEMS devices and should be considered in MEMS packaging design.
学科主题	力学
类目[WOS]	Engineering, Multidisciplinary ; Mathematics, Applied ; Mechanics ; Physics, Mathematical
研究领域[WOS]	Engineering ; Mathematics ; Mechanics ; Physics
收录类别	SCI
语种	英语
WOS记录号	WOS:000176903800061
公开日期	2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/15468]
专题	力学研究所_力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wang HY,Bai YL. Flip Chip Technologies and Their Applications in MEMS Packaging[J]. International Journal of Nonlinear Sciences and Numerical Simulation,2002,3(3-4):433-436.
APA	Wang HY,&Bai YL.(2002).Flip Chip Technologies and Their Applications in MEMS Packaging.International Journal of Nonlinear Sciences and Numerical Simulation,3(3-4),433-436.
MLA	Wang HY,et al."Flip Chip Technologies and Their Applications in MEMS Packaging".International Journal of Nonlinear Sciences and Numerical Simulation 3.3-4(2002):433-436.