Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe

	Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe
	Wang JL(王建立) ; Gu M(顾明) ; Zhang X(张兴) ; Wu GP(吴刚平)
刊名	Review of Scientific Instruments
	2009
卷号	80 期号:7 页码:No. 076107
合作状况	国内
收录类别	SCI+EI
语种	英语
公开日期	2011-04-19 ; 2011-06-09
内容类型	期刊论文
源URL	[http://ir.sxicc.ac.cn/handle/0/4116]
专题	山西煤炭化学研究所_中科院炭材料重点实验室_中科院炭材料重点实验室_期刊论文
推荐引用方式 GB/T 7714	Wang JL,Gu M,Zhang X,et al. Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe[J]. Review of Scientific Instruments,2009,80(7):No. 076107.
APA	Wang JL,Gu M,Zhang X,&Wu GP.(2009).Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe.Review of Scientific Instruments,80(7),No. 076107.
MLA	Wang JL,et al."Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe".Review of Scientific Instruments 80.7(2009):No. 076107.