Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

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	Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface
	Shi Ji-Peng ; Yang Fang-Zu ; Tian Zhong-Qun ; Zhou Shao-Min ; Yang FZ(杨防祖) ; Tian ZQ(田中群)
刊名	http://dx.doi.org/10.3866/PKU.WHXB201310092
	2013
关键词	DIFFUSION-CONTROLLED GROWTH ELECTROCHEMICAL NUCLEATION POLYCRYSTALLINE ADDITIVES TARTRATE NICKEL ZINC TIN NI
英文摘要	National Natural Science Foundation of China [21021002]; National Key Basic Research Program of China (973) [2009CB930703]; The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker-Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s(-1), the density of active nucleation sites (N-0) increased from 6.10x10(5) to 1.42x10(6) cm(-2), and the diffusion coefficient (D) was (6.13+/-0.62) x 10(-6) cm(2).s(-1).
语种	英语
出版者	PEKING UNIV PRESS
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/88720]
专题	化学化工－已发表论文
推荐引用方式 GB/T 7714	Shi Ji-Peng,Yang Fang-Zu,Tian Zhong-Qun,et al. Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface[J]. http://dx.doi.org/10.3866/PKU.WHXB201310092,2013.
APA	Shi Ji-Peng,Yang Fang-Zu,Tian Zhong-Qun,Zhou Shao-Min,杨防祖,&田中群.(2013).Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface.http://dx.doi.org/10.3866/PKU.WHXB201310092.
MLA	Shi Ji-Peng,et al."Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface".http://dx.doi.org/10.3866/PKU.WHXB201310092 (2013).